Japan
FIME JAPAN Co.,
ST Building 6F, 1-2-4, ShibaKoen, Minato-ku, Tokyo, 105-0011, Japan, Tokyo, Japan
A2LA|6036.01ISO/IEC 17025Register collected 2026-08-22
Certificates
1
Scope items
4
Locations
1
Contact this laboratory
Register record
- A2LACollected
- 6036.01Active
Certificates and scope
1A2LA
ISO/IEC 17025
Active6036.01
Accredited scope, certificate 6036.01
| Discipline | Method | Matrix | Range |
|---|---|---|---|
| electrical | MasterCard PayPass Performance Measurement; MasterCard PayPass Test Procedure for Performance Testing; MasterCard Acceptance Devices Approval Process Contactless Integration Testing for Acceptance Devices; MasterCard PayPass – Combination Test + Addendum to Combination Test Procedure; MasterCard Contactless Reader Specification; JCB Contactless IC Terminal Specification; JCB Contactless Terminal Functional Test Plan for JCB Proprietary; American Express Expresspay Terminal Specification; Discover Global Network D-PAS Connect Terminal Application Contactless Specification; Discover Global Network: D-PAS Connect/C6 Terminal Application Contactless Functional Test Plan; Discover Network Test Plan for Contactless Payment Devices (PCD & PICC) - Cross Testing Part | - | - |
| electrical | NFC Forum Type2 Tag Technical Specification; NFC Forum Test Cases for Type2 Tag; Type2 Tag Operation; NFC Forum Type3 Tag Technical Specification; NFC Forum Test Cases for Type3 Tag; Type3 Tag Operation; NFC Forum Type4 Tag Technical Specification; NFC Forum Test Cases for Type4 Tag; Type4 Tag Operation; NFC Forum Type5 Tag Technical Specification; NFC Forum Test Cases for Type5 Tag; Type5 Tag Operation; NFC Forum Analog Technical Specification; NFC Forum Test Cases for Tag Performance; EMV Integrated Circuit Card Specifications for Payment Systems Book 1 to 4; EMV Contactless Interface Specification; EMVCo Contactless Type Approval PCD Analogue Test Bench and Test Case Requirements; EMVCo Contactless Type Approval PCD Digital Test Cases; EMVCo Contactless Type Approval PCD Pre-Validation Test; EMV Contactless Specifications for Payment Systems Book C-2 Kernel 2 Specification; EMV Contactless Specifications for Payment Systems Book C-4 Kernel 4 Specification; EMV Contactless Specifications for Payment Systems Book C-5 Kernel 5 Specification; EMV Contactless Specifications for Payment Systems Book C-6 Kernel 6 Specification | - | - |
| electrical | - | - | - |
| electrical | ISO/IEC 17025:2017; EMV Contactless Interface Specification; NFC Forum Analog Technical Specification; NFC Forum Digital Protocol Technical Specification; NFC Forum LLCP Technical Specification; NFC Forum SNEP Technical Specification | Payment Cards; Smart Cards; Mobile Cards; Mobile Handsets; Payment Terminals; Tags | - |
Ranges are reproduced from the accredited scope document as published. An absent range means the register did not state one.
Location
ST Building 6F, 1-2-4, ShibaKoen, Minato-ku, Tokyo, 105-0011, Japan, Tokyo, JP
35.67686, 139.76389
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This page mirrors a public register. For a purchasing, audit or regulatory decision, confirm against the A2LA entry linked above.